Now that we've all scratched the crap out of our iphone circuit boards to do the h/w unlock I'm worried about oxidation - an unlikely but possible issue in the years to come.
My circuit board experience says that these boards are sealed for a reason to prevent oxidation, rust etc.
Are people re-sealing their contact point after completing the h/w unlock? if so, what are you using? I'm thinking a small dab of hot glue will do it but thought I'd get some more opinions. Realistically this is a tiny concern but better safe than sorry.