Hello

I have a friend who is wanting too know if his pc will be able to dual boot window and Snow leopard.He sent me a copy of his pc hardware using cpu id.If anyone could give me a idea on what his pc can install.I would be grateful to all your amazing minds

CPU-Z TXT Report
-------------------------------------------------------------------------

Binaries
-------------------------------------------------------------------------

CPU-Z version 1.55

Processors
-------------------------------------------------------------------------

Number of processors 1
Number of threads 1

APICs
-------------------------------------------------------------------------

Processor 0
-- Core 0
-- Thread 0 0

Processors Information
-------------------------------------------------------------------------

Processor 1 ID = 0
Number of cores 1 (max 1)
Number of threads 1 (max 1)
Name AMD Sempron LE-1250
Codename Sparta
Specification AMD Sempron(tm) Processor LE-1250
Package Socket AM2 (940)
CPUID F.F.2
Extended CPUID F.7F
Brand ID 1
Core Stepping DH-G2
Technology 65 nm
Core Speed 2210.2 MHz
Multiplier x FSB 11.0 x 200.9 MHz
HT Link speed 803.7 MHz
Stock frequency 2200 MHz
Instructions sets MMX (+), 3DNow! (+), SSE, SSE2, SSE3, x86-64
L1 Data cache 64 KBytes, 2-way set associative, 64-byte line size
L1 Instruction cache 64 KBytes, 2-way set associative, 64-byte line size
L2 cache 512 KBytes, 16-way set associative, 64-byte line size
FID/VID Control yes
Max FID 11.0x
Max VID 1.300 V
P-State FID 0x2 - VID 0x12 (5.0x - 1.100 V)
P-State FID 0xA - VID 0x10 (9.0x - 1.150 V)
P-State FID 0xC - VID 0x0E (10.0x - 1.200 V)
P-State FID 0xE - VID 0x0C (11.0x - 1.250 V)

K8 Thermal sensor yes
K8 Revision ID 6.0
Attached device PCI device at bus 0, device 24, function 0
Attached device PCI device at bus 0, device 24, function 1
Attached device PCI device at bus 0, device 24, function 2
Attached device PCI device at bus 0, device 24, function 3


Thread dumps
-------------------------------------------------------------------------

CPU Thread 0
APIC ID 0
Topology Processor ID 0, Core ID 0, Thread ID 0
Type 02002006h
Max CPUID level 00000001h
Max CPUID ext. level 80000018h
Cache descriptor Level 1, I, 64 KB, 1 thread(s)
Cache descriptor Level 1, D, 64 KB, 1 thread(s)
Cache descriptor Level 2, U, 512 KB, 1 thread(s)
Chipset
-------------------------------------------------------------------------

Northbridge NVIDIA MCP61 rev. A3
Southbridge NVIDIA MCP61 rev. A2
Memory Type DDR2
Memory Size 3072 MBytes
Channels Single
Memory Frequency 368.4 MHz (CPU/6)
CAS# latency (CL) 6.0
RAS# to CAS# delay (tRCD) 6
RAS# Precharge (tRP) 6
Cycle Time (tRAS) 18
Bank Cycle Time (tRC) 24
Command Rate (CR) 2T

Memory SPD
-------------------------------------------------------------------------

DIMM # 1
SMBus address 0x50
Memory type DDR2
Module format Regular UDIMM
Manufacturer (ID) Samsung (CE00000000000000)
Size 1024 MBytes
Max bandwidth PC2-6400 (400 MHz)
Part number M3 78T2863EHS-CF7
Serial number 92762724
Manufacturing date Week 23/Year 09
Number of banks 1
Data width 64 bits
Correction None
Nominal Voltage 1.80 Volts
EPP no
XMP no
JEDEC timings table CL-tRCD-tRP-tRAS-tRC @ frequency
JEDEC #1 4.0-4-4-12-16 @ 266 MHz
JEDEC #2 5.0-5-5-15-20 @ 333 MHz
JEDEC #3 6.0-6-6-18-24 @ 400 MHz

DIMM # 2
SMBus address 0x51
Memory type DDR2
Module format Regular UDIMM
Manufacturer (ID) Micron Technology (2C00000000000000)
Size 2048 MBytes
Max bandwidth PC2-6400 (400 MHz)
Part number 16HTF25664AY-800E1
Serial number E92749C3
Manufacturing date Week 29/Year 09
Number of banks 2
Data width 64 bits
Correction None
Nominal Voltage 1.80 Volts
EPP no
XMP no